INDUS™ 3-Up Cree XP-G4 95+ CRI Pro9™ White LED Star Board
Pro9™ white for color-critical lighting
A 95+ CRI Pro9™ white LED star with 98 CRI typical, designed for projects where color fidelity is central to the lighting brief. This Pro9™ version has a 2,000 mA maximum drive current.
95+ CRI Pro9™ (98 CRI typical) • 2700K–4000K • 3x Cree® XLamp® XP-G4 • 20 mm aluminum MCPCB
Quick Specs
| Parameter | Specification |
|---|---|
| Color rendering | 95+ CRI Pro9™; 98 CRI typical |
| Color temperatures | 2700K, 3000K, 3500K, 4000K |
| LED configuration | Three Cree® XLamp® XP-G4 LEDs; 3-series (3S) default |
| Forward voltage (3S) | 8.40 V typical / 9.90 V maximum at 700 mA, 85 °C |
| Maximum drive current | 2,000 mA |
| Thermal resistance, total board | 5.5 °C/W |
| Maximum case temperature | 80 °C at the designated Tc pad |
Applications
- Museum and gallery illumination
- Color-critical retail and display lighting
- Architectural accents for materials, finishes, and artwork
Photometric Performance
Minimum flux for the complete 3-up module at 700 mA and 85 °C.
| CCT | CRI | Minimum total flux (lm) |
|---|---|---|
| 2700 K | 95+ CRI Pro9™ (98 Typ) | 690 |
| 3000 K | 95+ CRI Pro9™ (98 Typ) | 750 |
| 3500 K | 95+ CRI Pro9™ (98 Typ) | 780 |
| 4000 K | 95+ CRI Pro9™ (98 Typ) | 810 |
Mechanical and Optical Integration
| PARAMETER | SPECIFICATION |
|---|---|
| Form factor | 20.0 ± 0.5 mm 6-lobe hexagonal star |
| Thickness | 1.6 ± 0.5 mm PCB (3.9 ± 0.5 mm overall height with LEDs) |
| Emitters | 3x Cree XLamp XP-G4, 3535 package (3.5 × 3.5 mm) |
| Substrate | Aluminum metal core PCB (MCPCB) |
| Optical mount | Center wire-pass hole + 3 alignment holes for 20 mm 3-up TIR optics |
| Mounting | Six #4 screw mounting points |
| Connections | Solder pads standard; flying leads or harness optional |
| Assembly | Pb-free, white solder mask, RoHS 3 compliant |
Ships configured as three LEDs in series via the J1/J2 jumpers. Individual LED drive requires an appropriate custom configuration. Use a constant-current LED driver and suitable heat sinking; observe the 2,000 mA maximum drive current and 80 °C maximum case temperature.
Ordering Options
Select Color Temperature (CCT) and Thermal Attachment above. All variants on this page are 95+ CRI Pro9™. Standard web orders use solder-pad termination (N).
| Thermal attachment | Part-number ending |
|---|---|
| None | NN |
| HexaTherm™ Thermal Pad | TN |
| 3M™ VHB™ Tape | VN |
Part-number format: ISA-3G4[CCT]95[BACKING]N. For example, ISA-3G43095TN is the 3000K version with a HexaTherm™ thermal pad and solder-pad termination. Contact sales for flying leads, harnesses, or custom configurations.
Compatible Accessories
| ACCESSORY TYPE | PART NO. | DESCRIPTION |
|---|---|---|
| Secondary TIR Optic | FO-20XPA3-PM-15C | Fusion Optix 20 mm 3-up TIR optic |
| Thermal Interface Pad | 0A001-401 | HexaTherm™ thermally conductive pad |
| Thermal Mounting Tape | 0A001-403 | 3M™ VHB™ thermally conductive tape |
| Passive Heatsink | 120-411 | Passive pin-fin/extruded heatsink, 400 cm² |
| LED Drivers | LUXdrive™ | Constant-current LED drivers |
Other XP-G4 CRI Versions
70+ CRI · 80+ CRI · 90+ CRI · 95+ CRI Pro9™
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