INDUS™ 3-Up Cree XP-G4 90+ CRI White LED Star Board

  • INDUS™ 3 - Up Cree XP - G4 80+ CRI White LED Star Board - Star Board - LEDdynamics
  • INDUS™ 3 - Up Cree XP - G4 80+ CRI White LED Star Board - Star Board - LEDdynamics
  • INDUS™ 3 - Up Cree XP - G4 80+ CRI White LED Star Board - Star Board - LEDdynamics
  • INDUS™ 3 - Up Cree XP - G4 80+ CRI White LED Star Board - Star Board - LEDdynamics
  • INDUS™ 3 - Up Cree XP - G4 80+ CRI White LED Star Board - Star Board - LEDdynamics
1 5

View our BAA/BABA Compliance page to learn about about how we can support making your project or product compliant.

Part#  ISA-3G42790NN

$16.52 USD
$16.52 USD
Sale Sold out
Color Temperature (CCT)
Thermal Attachment
Volume discounts reflected in cart; contact Sales for large or custom orders.
Product Datasheet
RoHS 3 Certificate
Warranty Information

High-CRI white for architectural and display lighting

A 90+ CRI white LED star for architectural spotlights, retail displays, and interior lighting where accurate color rendering is part of the specification.

90+ CRI • 2700K–4000K • 3x Cree® XLamp® XP-G4 • 20 mm aluminum MCPCB

Quick Specs

Parameter Specification
Color rendering 90+ CRI
Color temperatures 2700K, 3000K, 3500K, 4000K
LED configuration Three Cree® XLamp® XP-G4 LEDs; 3-series (3S) default
Forward voltage (3S) 8.40 V typical / 9.90 V maximum at 700 mA, 85 °C
Maximum drive current 3,000 mA
Thermal resistance, total board 5.5 °C/W
Maximum case temperature 80 °C at the designated Tc pad

Applications

  • Architectural spotlights and recessed downlights
  • Retail and merchandise display lighting
  • Gallery and hospitality lighting

Photometric Performance

Minimum flux for the complete 3-up module at 700 mA and 85 °C.

CCT CRI Minimum total flux (lm)
2700 K 90+ CRI 660
3000 K 90+ CRI 720
3500 K 90+ CRI 750
4000 K 90+ CRI 810

Mechanical and Optical Integration

PARAMETER SPECIFICATION
Form factor 20.0 ± 0.5 mm 6-lobe hexagonal star
Thickness 1.6 ± 0.5 mm PCB (3.9 ± 0.5 mm overall height with LEDs)
Emitters 3x Cree XLamp XP-G4, 3535 package (3.5 × 3.5 mm)
Substrate Aluminum metal core PCB (MCPCB)
Optical mount Center wire-pass hole + 3 alignment holes for 20 mm 3-up TIR optics
Mounting Six #4 screw mounting points
Connections Solder pads standard; flying leads or harness optional
Assembly Pb-free, white solder mask, RoHS 3 compliant

Ships configured as three LEDs in series via the J1/J2 jumpers. Individual LED drive requires an appropriate custom configuration. Use a constant-current LED driver and suitable heat sinking; observe the 3,000 mA maximum drive current and 80 °C maximum case temperature.

Ordering Options

Select Color Temperature (CCT) and Thermal Attachment above. All variants on this page are 90+ CRI. Standard web orders use solder-pad termination (N).

Thermal attachment Part-number ending
None NN
HexaTherm™ Thermal Pad TN
3M™ VHB™ Tape VN

Part-number format: ISA-3G4[CCT]90[BACKING]N. For example, ISA-3G43090TN is the 3000K version with a HexaTherm™ thermal pad and solder-pad termination. Contact sales for flying leads, harnesses, or custom configurations.

Compatible Accessories

ACCESSORY TYPE PART NO. DESCRIPTION
Secondary TIR Optic FO-20XPA3-PM-15C Fusion Optix 20 mm 3-up TIR optic
Thermal Interface Pad 0A001-401 HexaTherm™ thermally conductive pad
Thermal Mounting Tape 0A001-403 3M™ VHB™ thermally conductive tape
Passive Heatsink 120-411 Passive pin-fin/extruded heatsink, 400 cm²
LED Drivers LUXdrive™ Constant-current LED drivers

Other XP-G4 CRI Versions

70+ CRI · 80+ CRI · 90+ CRI · 95+ CRI Pro9™