INDUS™ 3-Up Cree XP-G4 Star Module

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Part#  ISA-3G42780NN

Regular price $16.52 USD
Regular price Sale price $16.52 USD
Sale Sold out
CCT & CRI
Thermal Attachment
Volume discounts reflected in cart; contact Sales for large or custom orders.

The 4th-Generation High-Power 20mm Hexagonal Star (ISA-203)

Architectural White Series (2700K–6500K) • 3x Cree® XLamp® XP-G4 • 3-Series (3S) Default • 20.0 mm MCPCB • Up to 3,360 lm

The INDUS™ 3-Up Cree® XP-G4 Star is a high-power, high-efficiency Architectural White lighting module built on a robust 20.0 mm hexagonal aluminum metal core PCB (MCPCB). Designed for compact directional fixtures, architectural spot lighting, museum and gallery illumination, and commercial applications, it packs three fourth-generation Cree XLamp XP-G4 LEDs into a tight optical footprint. Offered in industry-standard 80+ CRI, 90+ CRI, and 95+ CRI Pro9™ (98 CRI typical) configurations, the board ships factory-configured as 3-in-series (3S) by default while retaining individual LED selection pads for full backward compatibility with legacy INDUS stars.

Quick Specs

  • Forward Voltage (3S): 8.40 V typ. (9.90 V max) @ 700 mA, 85 °C
  • Maximum Lumen Output: Up to 3,360 lm @ 3,000 mA (80+ CRI)
  • Maximum Drive Current: 3,000 mA (70+ / 80+ / 90+ CRI) | 2,000 mA (95+ CRI Pro9™)
  • Architectural Color Rendering: 80+ CRI, 90+ CRI, and 95+ CRI Pro9™ (95 CRI min, 98 CRI typ.)
  • Optics Ready™ Footprint: Fits standard 20 mm 3-up TIR optics (Spot 25°, Medium 35°, Wide 45°, Elliptical 50° × 15°)

Key Features

  • High Lumen Output & 95+ CRI Pro9™ Option: Delivers up to 930 lm (80+ CRI), 810 lm (90+ CRI), or 810 lm (95+ CRI Pro9™, 98 CRI typ.) at 700 mA, 85 °C—with 95+ CRI Pro9™ delivering higher minimum flux than standard 90+ CRI across 2700K–3500K.
  • 3-Series (3S) Default with Jumper Selection: Ships configured as 3-in-series (3S) via two populated 0 Ω jumpers (J1/J2) for single-channel constant-current drivers, while supporting individual per-LED addressability via six onboard solder pads.
  • Optimized Thermal Path: Aluminum MCPCB construction provides a low total board thermal resistance of 5.5 °C/W and an 80 °C maximum case temperature (Tc) rating.
  • Modular 20 mm Ecosystem: Pairs directly with standard 20 mm 3-up TIR optics (FO-20XPA3-PM-15C), HexaTherm™/VHB™ thermal pads, and the 120-411 passive heatsink.
  • RoHS 3 & Pb-Free Construction: Built with white reflective solder mask and lead-free assembly.

Applications

  • Commercial track heads
  • Architectural spotlights
  • Retail display accents
  • Recessed downlights
  • Museum & gallery lighting
  • Industrial task lights & exterior landscape uplighting

Photometric Performance

Hot-rated at 85 °C, If = 700 mA. Flux is the minimum for the full 3-up module; optic columns give center-beam intensity (cd).

CCT CRI MIN. TOTAL FLUX (lm) SPOT 25° (cd) MEDIUM 35° (cd) WIDE 45° (cd) ELLIPTICAL 50 × 15° (cd)
2700 K 80+ CRI 840 5,640 2,880 1,620 2,490
3000 K 80+ CRI 870 5,850 2,988 1,680 2,580
3500 K 80+ CRI 900 6,048 3,090 1,737 2,667
4000 K 80+ CRI 930 6,150 3,147 1,770 2,718
5000 K 80+ CRI 930 6,150 3,147 1,770 2,718
6500 K 80+ CRI 930 6,150 3,147 1,770 2,718
2700 K 90+ CRI 660 4,434 2,268 1,275 1,959
3000 K 90+ CRI 720 4,824 2,466 1,386 2,133
3500 K 90+ CRI 750 5,040 2,580 1,452 2,232
4000 K 90+ CRI 810 5,442 2,784 1,566 2,406
2700 K 95+ CRI Pro9™ (98 Typ) 690 4,434 2,268 1,275 1,959
3000 K 95+ CRI Pro9™ (98 Typ) 750 4,824 2,466 1,386 2,133
3500 K 95+ CRI Pro9™ (98 Typ) 780 5,040 2,580 1,452 2,232
4000 K 95+ CRI Pro9™ (98 Typ) 810 5,442 2,784 1,566 2,406

Note: Center-beam intensity (cd) values on 90+ CRI and 95+ CRI Pro9™ tiers reflect the 90+ CRI baseline. Cree Pro9™ LEDs deliver 95+ CRI minimum and 98 CRI typical.

Electrical & Thermal Specifications

PARAMETER CONDITIONS TYP MAX UNIT
Circuit configuration 3-series (3S) default via solder / 0 Ω jumpers; individual LED selection supported on PCB
Forward voltage, module (3S) If = 700 mA, 85 °C 8.40 9.90 V
Forward voltage, per emitter If = 700 mA, 85 °C 2.80 3.30 V
Test current — 700 — mA
DC forward current, Standard (70+ / 80+ / 90+ CRI) Continuous — 3,000 mA
DC forward current, Pro9™ (95+ CRI) Continuous — 2,000 mA
Power dissipation If = 700 mA 5.88 — W
Power dissipation, Standard (70+ / 80+ / 90+ CRI) If = 3,000 mA — 29.88 W
Power dissipation, Pro9™ (95+ CRI) If = 2,000 mA — 19.20 W
Thermal resistance, total board 3 emitters 5.5 — °C/W
Maximum case temperature At Tc pad — 80 °C
Viewing angle, bare emitter (FWHM) 2θ1/2 120 — °
Case temperature reference Designated onboard Tc measurement pad

Viewing angle is the bare-emitter value from the Cree XLamp XP-G4 data sheet.

Mechanical

PARAMETER SPECIFICATION
Form factor 20.0 ± 0.5 mm 6-lobe hexagonal star
Thickness 1.6 ± 0.5 mm PCB (3.9 ± 0.5 mm overall height with LEDs)
Emitters 3x Cree XLamp XP-G4, 3535 package (3.5 × 3.5 mm)
Substrate Aluminum metal core PCB (MCPCB)
Optical mount Center wire-pass hole + 3 alignment holes for 20 mm 3-up TIR optics
Mounting Six #4 screw mounting points
Connections Solder pads standard; flying leads or harness optional
Assembly Pb-free, white solder mask, RoHS 3 compliant

Ordering Information

PART NUMBER CONFIG. CCT CRI MIN. FLUX (lm) MAX CURRENT
ISA-3G42780 3S Default 2700 K 80+ CRI 840 lm 3,000 mA
ISA-3G43080 3S Default 3000 K 80+ CRI 870 lm 3,000 mA
ISA-3G43580 3S Default 3500 K 80+ CRI 900 lm 3,000 mA
ISA-3G44080 3S Default 4000 K 80+ CRI 930 lm 3,000 mA
ISA-3G45080 3S Default 5000 K 80+ CRI 930 lm 3,000 mA
ISA-3G46580 3S Default 6500 K 80+ CRI 930 lm 3,000 mA
ISA-3G42790 3S Default 2700 K 90+ CRI 660 lm 3,000 mA
ISA-3G43090 3S Default 3000 K 90+ CRI 720 lm 3,000 mA
ISA-3G43590 3S Default 3500 K 90+ CRI 750 lm 3,000 mA
ISA-3G44090 3S Default 4000 K 90+ CRI 810 lm 3,000 mA
ISA-3G42795 3S Default 2700 K 95+ CRI Pro9™ (98 Typ) 690 lm 2,000 mA
ISA-3G43095 3S Default 3000 K 95+ CRI Pro9™ (98 Typ) 750 lm 2,000 mA
ISA-3G43595 3S Default 3500 K 95+ CRI Pro9™ (98 Typ) 780 lm 2,000 mA
ISA-3G44095 3S Default 4000 K 95+ CRI Pro9™ (98 Typ) 810 lm 2,000 mA

Part Number Nomenclature: ISA-3G4[CCT][CRI][BACKING][TERMINATION]
Example: ISA-3G43080TF = 3-Up XP-G4, 3000 K, 80+ CRI, thermal pad backing, flying leads.

SERIES / CONFIG. CCT CRI BACKING TERMINATION
ISA — INDUS 20 mm hex star
3G4 — 3-Up Cree XP-G4, 3S default
27 — 2700 K
30 — 3000 K
35 — 3500 K
40 — 4000 K
50 — 5000 K
65 — 6500 K
70 — 70+ CRI
80 — 80+ CRI
90 — 90+ CRI
95 — 95+ CRI Pro9™ (98 CRI typ.)
N — None
T — HexaTherm™ thermal pad
V — 3M™ VHB™ tape
N — Solder pads
F — Flying leads
H — Harness
  • 90+ CRI and 95+ CRI Pro9™ (98 CRI typ.) are offered from 2700 K to 4000 K; see Photometric Performance above.
  • Standard web orders ship with Solder Pads (N) termination; contact sales for Flying Leads (F) or Harness (H) assemblies.
  • Boards without J1/J2 jumpers (individual per-LED drive) require a custom part number.

Compatible Accessories

ACCESSORY TYPE PART NO. DESCRIPTION
Secondary TIR Optic FO-20XPA3-PM-15C Fusion Optix 20 mm 3-up TIR optic
Thermal Interface Pad 0A001-401 HexaTherm™ thermally conductive pad
Thermal Mounting Tape 0A001-403 3M™ VHB™ thermally conductive tape
Passive Heatsink 120-411 Passive pin-fin/extruded heatsink, 400 cm²
LED Drivers LUXdrive™ Constant-current LED drivers