INDUS™ 3-Up Star Board – Cree XLamp® XP-L2 Performance White, 80+ CRI

Three-Emitter White-Light Performance for Demanding Applications

For industrial, outdoor, and specialty lighting applications, multiple LED sources provide fixture manufacturers with flexibility when developing compact, high-performance lighting assemblies. The INDUS™ 3-Up Performance White star board features three Cree XLamp® XP-L2 LEDs in an integrated hexagonal configuration, delivering 80+ CRI white-light performance for applications where dependable illumination and practical operating performance take priority over premium color rendering. It provides an integrated multi-emitter solution for OEMs developing fixtures around three LED sources.

Demanding Professional Applications

Industrial & Equipment Lighting

Outdoor & Security Lighting

Specialty & Portable Lighting

Three Emitters

Three integrated Cree XLamp® XP-L2 emitters. 1-Up version also available.

80+ CRI Performance

Practical white-light output for multi-source lighting applications.

INDUS PCB Platform

20 mm nominal hexagonal footprint for space-conscious fixture designs.

Specify the 80+ CRI Performance White tier for multi-emitter lighting assemblies where integrated LED placement, dependable illumination, and compact fixture development are important design priorities.

The INDUS™ White Platform: 20 mm Flexibility

The INDUS™ 3-Up XP-L2 White board brings the Performance White tier to the INDUS 20 mm hexagonal platform. It provides fixture manufacturers with an integrated three-emitter option for developing compact lighting products where practical illumination and dependable operating performance are the primary requirements.

Quick Specs

Parameter	Specification
Color rendering	80+ CRI minimum
LED configuration	Three Cree® XLamp® XP-L2 LEDs; 3-series (3S) default wiring
Forward voltage (3S)	8.37 V typical / 9.30 V maximum at 1,050 mA, 85 °C
Maximum drive current	3,000 mA

Photometric Performance

Minimum flux for the complete 3-up module at 1,050 mA and 85 °C.

CCT	CRI	Minimum total flux (lm)
2700 K	80+ CRI	1260
3000 K	80+ CRI	1320
4000 K	80+ CRI	1380

Mechanical and Optical Integration

PARAMETER	SPECIFICATION
Form factor	19.9 mm flat-to-flat 6-lobe hexagonal star (20.0 mm nominal)
Thickness	1.6 mm PCB
Emitters	3x Cree XLamp XP-L2, 3535 package (3.45 × 3.45 mm)
Optical mount	Center wire-pass hole + 3 alignment holes for 20 mm 3-up TIR optics
Mounting	Six notch mounting points for #4 or M3 screws
Connections	Solder pads standard

Use a constant-current LED driver and suitable heat sinking; observe the 3,000 mA maximum drive current.

Ordering Options

Select Color Temperature (CCT) and Thermal Attachment above. All variants on this page are 80+ CRI. Standard web orders use solder-pad termination (N).

Thermal attachment	Part-number ending
None	-NN
3M™ 8810 Thermal Pad (die-cut hex)	-TN
3M™ VHB™ 4905 Tape (die-cut hex)	-VN

Part-number format: ISA-3L2[CCT]80-[BACKING]N. For example, ISA-3L23080-TN is the 3000K version with a 3M 8810 thermal pad and solder-pad termination. Contact sales for flying leads (F), harnesses, or custom configurations.

Compatible Accessories

Important Thermal Notice: At 1,050 mA, the 3-Up XP-L2 dissipates approximately 8.8 W, exceeding the capacity of the standard 6W 2011ASL silver heatsink. Use appropriate higher-capacity thermal management.

ACCESSORY TYPE	PART NO.	DESCRIPTION
Secondary TIR Optic	FO-20XPA3-PM-15C	Fusion Optix 20 mm 3-up TIR optic
Thermal Interface Pad	0A001-401	Laser-cut 3M™ 8810 thermal pad (die-cut hex)
Mounting Tape	0A001-403	3M™ VHB-4905 clear acrylic mounting tape (die-cut hex)
Passive Heatsink	2011ASL	6W Silver Round Finned Heatsink (suitable only for lower drive currents)

Downloads

↓ Download 3D CAD Model (.STEP)

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